Importance of Environmental-Friendly High Density Packaging and Interconnection
نویسندگان
چکیده
منابع مشابه
Challenges in Interconnection and Packaging
Integrated circuit packaging and their testing is well advanced because of the maturity of the IC industry, their wide applications, and availability of industrial inhstructure. [ 1,2] This is not true for MEMS with respect to packaging and testing. It is more difficult to adopt standardized MEMS device packaging for wide applications although MEMS use many similar technologies to IC packaging....
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 1998
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.1.257